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Semiconductor Packaging And Test Market In China to grow at a CAGR of 7.05% by revenue by 2019 Technology Articles | February 1 Matt Gay Jersey , 2016

MarketResearchReports.Biz has announced addition of new report “Semiconductor Packaging And Test Market In China 2015-2019” to its database.



About semiconductor packaging and testing


Semiconductor packaging involves casing of materials such as metal, plastic, glass Anthony Nelson Jersey , or ceramic on the silicon wafer. These casings usually contain one or more semiconductor electronic components. A casing protects the silicon wafer against corrosion and impact, clamps the contact pins or leads used to connect the external circuits to the device, and dissipates heat produced in the device. Though packages are usually made in accordance to industry standards Mike Edwards Jersey , they meet the specifics of an individual manufacturer.


Wafer testing is executed during the semiconductor device fabrication. This involves the testing of all individual integrated circuits present on the wafer. The individual circuits are tested for functional defects using special test patterns. The testing is carried out using an equipment called a wafer prober or handler. Testing is also carried out using testing methods such as system level tests and burn-in method.


Technavio's analysts forecast the semiconductor packaging and test market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019.


Covered in this report


The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview. The market has been segmented and sub-segmented on the following basis:


By business type :


IDM (integrated devices manufacturers)


Outsourced semiconductor assembly and test (OSAT)


Download Sample Copy of this Report at: http:www.marketresearchreports.bizsamplesample471685


Technavio's report, Semiconductor Packaging and Test Market in China in 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the landscape of semiconductor packaging and test market in China market and its opportunities in the coming years. The report includes a discussion of the key vendors operating in this market.


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Key vendors


Amkor


ASE


PowerTech


SPIL


STATS ChipsPAC


UTAC


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Other prominent vendors


ChipMos


Greatek


Huanhong


JCET


KYEC


Lingsen Precision


Nepes Corporation


SMIC


Tianshui Huatian


Unisem


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Key market driver


Growth of semiconductor chip application market


For a full Jamel Dean Jersey , detailed list, view our report


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Key market challenge


Short lifecycle of semiconductor devices


For a full, detailed list Sean Murphy-Bunting Jersey , view our report


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Key market trend


Emergence of 3D packaging


For a full, detailed list, view our report


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Key questions answered in this report


What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be


What are the key market trends


What is driving this market


What are the challenges to market growth


Who are the key vendors in this market space


What are the market opportunities and threats faced by the key vendors


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Natural Calcium Formula Supplements To Strengthen Bones Naturally Health Articles | November 14, 2016

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